Canon i-line steppers provide high-throughput, accurate overlay and 350nm resolution for a variety of imaging applications ranging from Integrated Circuits, R/W heads, MEMS, Image Sensors to LEDs.
Canon steppers have also been developed to support the demands of Advanced Packaging, Through-Silicon Vias (TSV) and 3D Integration applications.
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FPA-5510iV: Wide-field, i-line stepper with large Depth of Focus supporting Advanced Packaging technology and 3D Integration |
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The FPA-5510iZ is a high throughput 4X i-line stepper that delivers a significant CoO advantage when exposing layers down to 280nm and is a perfect mix-and-match partner for 200mm and 300mm DUV scanners |
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FPA-5550iZ: High throughput i-line stepper with mix and match capability |
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Achieves 0.35µm resolution and 100wph throughput 0n 200mm wafers (120wph on 150mm wafers). Field size is 22mm x 22mm. Integrates with other FPA-3000 tools such as the FPA-3000EX6 KrF stepper for optimum mix and match lithography. |